SiGe Semiconductor, Inc.

Recent Articles for SiGe Semiconductor, Inc.:

Integrated Wi-Fi FEIC targets mobile devices
The SE2601T Wi-Fi chip is an RF switch/LNA front-end IC (FEIC) designed to enhance the performance and functionality of . . .

Si-based 2.4-GHz PA operates at 26 dBm
Measuring 3 x 3 x 0.9 mm, the 2.4-GHz SE2576L wireless LAN power amplifier (PA) module operates at 26 . . .

FEM complements WLAN chipsets
The SE2600S front-end module (FEM) complements WLAN chipsets with integrated WLAN PAs that target fast-growth WLAN-enabled mobile terminal applications. . . .

FEM operates in both WLAN, Bluetooth mode
Suited for concurrent WLAN and Bluetooth operation and direct-to-battery connection, the SE2579U front-end-module (FEM) is a complete 802.11 b/g/n . . .

Wi-Fi front-end module is highly integrated
Targeted at embedded applications including cellular handsets, gaming, digital cameras and personal media players (PMP), the SE2571U front-end module . . .