Molex Incorporated

 

Molex Power Integrity Engineering Power connector performance in a given application is becoming more critical due to increasing current demands. It’s also becoming increasingly more difficult to predict. Molex understands performance trade-offs and challenges and is leading the way in developing high current power products targeted to today’s most demanding applications.

Join Michael Bean from Molex for an 20 minute Webcast discussing power interconnect selection and key design considerations, including:

- Power density
- Thermal performance
- Contact reliability
- Contact material & design
- System performance curves

In less than 20 minutes, you’ll gain an understanding of how Molex EXTreme Power® Products are pushing the interconnect technology and packaging envelopes to offer designers more flexibility and greater power density options.

If your application calls for a switch product that’s reliable,customized and can stand up to the harshest environments,trust the world’s largest switch manufacturer – Molex. Our capabilities cater to almost any industry, so we can work with you to create a fitting solution that meets your specific needs.

As the latest additions to the Molex Mini-Fit® product line, our new high-current, high-density connectors are ideal for telecom, medical, industrial, computer and power supply applications. The Mini-Fit Plus HCS (High-Current System) includes crimp terminals, headers and receptacles that increase current power loads to up to 13A per circuit. In addition, this product will allow for increased mating cycles. Plus, their patented design expands wipe lengths and contact areas without changing the connector footprint. Our Mini-Fit RTC Reflow Temperature Compatible headers feature a special housing made of LCP that can withstand solder-reflow temperatures of up to 265º C. Learn how these systems can enhance your designs now.