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Ironwood Electronics, Inc.

Includes 40 GHz bandwidth sockets for BGA and QFN, only slightly larger than IC with integral heatsink for medium power and optional heatsinking to over 100 watts. Up to 500k insertions. Adapters for prototype, test, package conversion, and more. Quick-Turn volume adapters are our specialty.
1335 Eagandale Court
Eagan, MN 55121
USA
WebSite: http://www.ironwoodelectronics.com
Phone: 952-229-8200
Toll Free: 800-404-0204
Fax: 952-229-8201
Email: info@ironwoodelectronics.com
   

Product Information Pages for Ironwood Electronics, Inc.:
GHz BGA & QFN/MLF Sockets
GHz BGA & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF (Zero Insertion Force) socket for prototype and test applications. Our sockets support pitches down to 0.3mm.
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Giga-snaP™ BGA SMT Adapters
Giga-snaP™ line of BGA adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles reliably and will not warp as plastic molded parts. Insertion force is half of competitive products and better transmission of high frequen
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Prototyping Adapters
Ironwood Electronics has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFN, QFP, SOIC, PGA, PLCC, QIP, and DIP packages. We use high quality production and test burn-in sockets for reliable connections. Most popular development panels are supported.
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Custom Sockets
Ironwood Electronics has the largest, most experienced engineering staff in our industry. Quick turn custom solutions are our specialty, with some custom solutions available as fast as 1 week. Our engineers utilize advanced tools to design precision and quality into each product. We are dedicated to
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Silver Ball Matrix Sockets
Ironwood Electronics SM/SMP socket uses SM & SMP contact technology for high speed, low inductance, high endurance and wide temperature applications. SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter
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Surface Mount Package Emulation
Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of SMT devices. We offer SMT bases and thru-hole adapters for BGA, QFN, MLF, PLCC, QFP, and SOIC packages. SMT Package Emulators provide highest speed, reliability, and lowest insertion force.
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Turn-key Capabilities - RoHS Compliant
Ironwood has the largest, most experienced engineering staff in our industry. Fast, high quality, quick turn custom projects are our specialty. We can provide complete turn-key solutions for subsystems and IC upgrades.
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IC Sockets
Ironwood provides six different contact technologies and various socket configurations for IC devices
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Stamped Spring Pin Sockets
SBT sockets simplify lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin sockets. To use, drop the IC into the socket, place the floating compression plate over the IC, add the swivel the lid (with key-hole slots), and apply a norma
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Sockets & Receptacles
Sockets and receptacles provide pluggable interface for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. Ironwood offers the industry's widest array of high quality sockets and receptacles. Our parts utilize gold plated pins and through-hole co
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Spring Pin Sockets
The Spring Pin Socket line allows very high endurance and wide temperature range testing of 0.3mm to 1.27mm pitch BGA, LGA , QFN QFP and SOIC devices on the same footprint as other Ironwood socket technologies. This allows different PCB's with same footprint to accomplish many different test applica
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PLCC Clips & Socket Plugs
We offer PLCC adapters that will snap onto the PLCC package or insert into a PLCC socket. These adapters provide reliable access and interconnection to all signals.
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Videos for Ironwood Electronics, Inc.:
GHz BGA socket for 8x12mm memory devices
Socket your High-density DDR3 Memory packages using elastomer socket with superior electrical performance
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch, 8x12mm memory device. GHz BGA socket is designed for testing memory device packaged in ball grid array format and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per I/O. The socket connects all pins with 8 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The socket also incorporates a new quick insertion method using shoulder screws and swivel socket lid so that IC's can be changed out quickly. The socket also features floating compression mechanism to accommodate package manufacturing variations. GHz BGA sockets are constructed with high performance and low inductance gold plated embedded wire on elastomer as interconnect material between device and PCB. The temperature range is -35C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.